BS EN 61188-5-8:2008

What is BS EN 61188-5-8 – Attachment considerations for printed boards about?

BS EN 61188-5-8 is an international standard that focuses on printed board assemblies and attachment methods for electronic components.

BS EN 61188-5-8 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns, or protective coated lands.

BS EN 61188-5-8 specifies the technical specification such as general information, BGA(square) field of applications, component dimensions, solder joint fillet design, land pattern design, FBGA(square), BGA(rectangular), etc., for area array components (BGA, FBGA, CGA, LGA).   

Who is BS EN 61188-5-8 – Attachment considerations for printed boards for?

BS EN 61188-5-8 on attachment considerations for printed boards is useful for:

• Manufacturers of printed circuit boards (PCBs) 
• Manufacturers of electronic components and interconnecting structures 
• Manufacturers and suppliers of laminate sheets 
• Quality control and testing personnel 
• Regulatory authorities

Why should you use BS EN 61188-5-8 – Attachment considerations for printed boards?

The area array family is characterized by terminations that are on a particular pitch and contain several rows and columns for the total IO termination pin count. The BGA family uses a solder ball as terminations and may have a square or rectangular package configuration. The family includes both moulded plastic and ceramic case styles.

BS EN 61188-5-8 covers land patterns for area array components which include ball grid array (BGA) parts (rigid, flexible, or ceramic substrate), fine pitch ball grid array (FBGA) parts (rigid or flexible substrate); column grid array (CGA) parts (ceramic substrates) and land grid array (LGA) parts (ceramic substrates). It contains information on the area array family of components and their requirements for appropriate land patterns.

BS EN 61188-5-8 proposes the land pattern dimensions, based upon the fundamental tolerance calculation combined with the given land geometries and courtyard excesses. It also defines two levels of land pattern dimensioning. One level (level 2) is for non-collapsing BGA balls; the other level (level 3) is for those BGA components where the ball does collapse around the land.

BS EN 61188-5-8 helps you to verify the SMD land patterns used for achieving an undisturbed mounting process including testing and ensuring reliability for the product stress conditions in use.