PD IEC TR 61191-7 is an international standard for printed board assemblies that provides information on technical cleanliness which helps in increasing the performance and reliability of printed boards.
PD IEC TR 61191-7 is the seventh part of printed board assemblies in multi-series.
PD IEC TR 61191-7 serves as a Technical Report and provides information, on how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
PD IEC TR 61191-7 on printed board assemblies is useful for:
Technical cleanliness is important to ensure continued optimum performance, quality and durability.
PD IEC TR 61191-7 guidelines helps in removing the contamination from the parts and determining the component cleanliness. The process flow is summarized within different clusters in the supply chain of the electronics industry.
The cold cleaning process helps to detach more particles than particles detached during field operation. The environment cleanliness analysis is helpful in determining the contamination level on the particle trap.
PD IEC TR 61191-7 is useful in designing the cleanliness controlled which helps in generating the minimum particles during the assembling of the components of printed board circuits. This electromechanical component cluster determines the performance of electric connectors used in printed boards.
PD IEC TR 61191-7 specifies the technical reports which provides information about the technical cleanliness while assembling the printed board circuits.
IEC/TR 61191-7 Ed.1.0