BS EN IEC 61191‑1 is the first part of an international standard covering printed board assemblies that specifies the requirements for soldered electrical and electronic assemblies, ensuring safety, operability and performance in electrical and electronic applications.
BS EN IEC 61191‑1 prescribes requirements for materials, methods, and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies.
Note: This part of IEC 61191 also includes recommendations for good manufacturing processes.
BS EN IEC 61191‑1 on Printed board assemblies is useful for:
Printed circuit boards are useful in connecting the electronic components using conductive pathways, tracks, or signal traces. Therefore, by using BS EN IEC 61191‑1 you will be able to connect electronic components by assembling these printed boards.
With the help of BS EN IEC 61191-1, you can identify the requirement to be used in assembling the printed boards. This requirement helps in choosing the appropriate materials which are not harmful to the environment.
The cleaning and residue requirements mentioned in BS EN IEC 61191‑1 are useful in preventing thermal shock and intrusion. By using this cleaning process, you can remove the contamination that helps in not to use the degraded materials in the assembling process.
BS EN IEC 61191‑1 provides users guidance on visual examination that is useful in avoiding defects or failures while assembling the soldered electrical and electronic assemblies.
Guidance in BS EN IEC 61191‑1, allows users to develop and assess printed board assemblies, ensuring their operability, performance and longevity in different climatic conditions.
BS EN IEC 61191‑1:2018 supersedes BS EN 61191‑1:2013. BS EN IEC 61191‑1:2018 includes some technical changes with respect to BS EN 61191‑1:2013. These include:
EN 62129-2:2011
EN IEC 61191-1:2018
IEC 61191-1:2018