BS EN 61191-6:2010

What is BS EN 61191-6 -  Evaluation of voids in BGA and LGA soldered connections about?  

BS EN 61191-6 is the sixth part of a multi-series standard used for Printed board assemblies that specifies the measuring methods for voids in soldered joints of BGA and LGA. BS EN 61191-6 is useful in evaluating these voids that results in manufacturing good quality printed boards.  

BS EN 61191-6 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board.  

Note 1: This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. 

Note 2: BS EN 61191-6 is intended for evaluation purposes and is applicable to: 

• Research studies 
• Off-line production process control and 
• Reliability assessment of assembly 

Note 3: BS EN 61191-6 is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. 

Note 4: BS EN 61191-6 is applicable to macrovoids of the sizes of from 10 μm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 μm in diameter. 

Who is BS EN 61191-6 -  Evaluation of voids in BGA and LGA soldered connections for? 

BS EN 61191-6 on Printed board assemblies is useful for: 

• Manufacturer of electronic components  
• Manufacturer of automotive parts 
• Manufacturer of printed circuit boards 
• Electronic engineers 

Why should you use BS EN 61191-6 -  Evaluation of voids in BGA and LGA soldered connections?  

Printed circuit boards (PCBs) are useful for supporting mechanically and electrically connecting electronic components. This is connected by using conductive pathways, tracks or signals. Hence the solder joints help in joining or bonding these BGA and LGA which are used in printed circuit boards.  

BS EN 61191-6 specifies the measuring method for voids in soldered joints of BGA and LGA. This also helps in calculating the void occupancy by maximum cross-section area of the soldered joint and voids. The intensity of X-ray is useful in detecting and measuring the voids in solder joints. With the help of BS EN 61191-6, you can evaluate the voids in soldered joints used in printed circuit boards.  

By applying BS EN 61191-6, you can ensure the reliability of these soldered joints of BGA and LGA that result in manufacturing good quality printed circuit boards.