BS EN IEC 60286‑3 is the third part of a British standard used for the packing of components for automatic handling. By using BS EN IEC 60286‑3 you can prevent these components from external damages.
BS EN IEC 60286‑3 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. BS EN IEC 60286‑3 includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. BS EN IEC 60286‑3 also includes requirements related to the packaging of singulated die products including bare die, and bumped die (flip chips). BS EN IEC 60286‑3 also covers the use of tape packaging for components, and singulated dies for test purposes and other operations.
BS EN IEC 60286‑3 on the packaging of components for automatic handling is applicable to:
Using BS EN IEC 60286‑3 you can classify the various types of tapes such as carried tape dimension, pressed carried tape with top cover tape, blister carried tape these tapes are useful in packaging surface mount components. These tapes packing helps in removing the cavity or compartments in a vertical direction without mechanical restriction. BS EN IEC 60286‑3 helps in withstanding the storage of tape components which is not affected by the chemical reaction. This taping ensures the sustainability of these components in different climatic conditions which results in minimizing the effect of losing components by electrostatic discharge.
By using BS EN IEC 60286‑3 you can prevent contamination, and ensures the protection to these components. With the help of this packing, you can handle, and assemble these components easily. By applying BS EN IEC 60286‑3 the delivery process of these components becomes easy.
BS EN IEC 60286‑3:2019 supersedes BS EN 60286‑3:2013 which has been withdrawn. BS EN IEC 60286‑3:2019 includes some technical changes with respect to BS EN 60286‑3:2013. These include:
EN 61300-2-10:2012
EN IEC 60286-3:2019
IEC 60286-3:2019