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BS 4584-103.1:1990 | 28 Feb 1990 | BSI Knowledge
Standard
Withdrawn
BS 4584-103.1:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits - Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Published:
28 Feb 1990
•
Withdrawn:
24 Apr 2012
Overview
Preview
References
History
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Product Details
Descriptors
Flameproof materials
Sheet materials
Printed-circuit boards
Printed circuits
Permittivity
Thickness measurement
Test specimens
Marking
Time measurement
Flow measurement
Gelation
Impregnated materials
Bonding
Reinforced materials
Textile glass
Dissipation factor
Testing conditions
Packaging
Laminates
Heating tests
Defects
Sample location
Determination of content
Epoxy resins
Volatile matter determination
Rolls
Specimen preparation
Printed-circuit bases
Dielectric strength
Flammability
Woven fabrics
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
IEC 60249-3-1:1981
ISBN
0 580 18172 3
Publisher
BSI