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BS 4584-103.2:1990 | 28 Feb 1990 | BSI Knowledge
Standard
BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits - Specification for copper foil for use in the manufacture of copper-clad base materials
Current
•
Published:
28 Feb 1990
Overview
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References
History
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Product Details
Descriptors
Metal coatings
Sampling methods
Electro-analytical methods
Printed circuits
Printed-circuit boards
Wettability
Penetration tests
Surface treatment
Printed-circuit bases
Elongation
Rolls
Mass
Packaging
Electrical conductivity
Test equipment
Grades (quality)
Coated materials
Thickness
Foil
Tensile testing
Tensile strength
Test specimens
Dimensional tolerances
Roughness (surface)
Copper
Defects
Marking
Weight measurement
Purity
Stain tests
Testing conditions
Laminates
Specimen preparation
Width
Electrical resistance
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
0 580 18190 1
Publisher
BSI