BS 3934-5:1992

Mechanical standardization of semiconductor devices - Recommendations for tape automated bonding (TAB) of integrated circuits

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Product Details

Descriptors

Integrated circuits

Perforations

Assembling

Tape

Mechanical behaviour of materials

Electrical connections

Mechanical properties of materials

Flexible materials

Electronic equipment and components

Spaced

Standardization

Dimensions

Semiconductor devices

Bonding

ICS Codes

31.080.01 Semiconductor devices in general

Committee

EPL/47

International relationships

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ISBN

0 580 20250 X

Publisher

BSI