Standard

BS 3934-5:1997

Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuits

•

Visit the preview section for more information

Product Details

Descriptors

Dimensional tolerances

Tape

Films (states of matter)

Perforations

Mechanical behaviour of materials

Datum

Mechanical properties of materials

Dimensions

Standardization

Codes

Bonding

Electronic equipment and components

Holes

Electrical connections

Flexible materials

Integrated circuits

Semiconductor devices

ICS Codes

31.080.01 Semiconductor devices in general

Committee

EH/3

International relationships

Identical to:

IEC 60191-5:1997

ISBN

0 580 27812 3

Publisher

BSI