BS EN 60191-6-21:2010

What is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) about?  

BS EN 60191-6-21 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices.  

BS EN 60191-6-21 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance with IEC 60191-4. 

Who is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) for? 

BS EN 60191-6-21 on Mechanical standardization of semiconductor devices is useful for: 

• Manufacturers of semiconductor devices 
• Manufacturers of electronic devices 
• Manufacturers of automotive parts 
• Electronic engineers 
• Semiconductor foundries 

Why should you use BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP)?  

A semiconductor device is an electronic component that contains the electronic properties of semiconductor material. 

BS EN 60191-6-21 specifies the rules for measuring method for package dimensions of small outline packages (SOP). This measuring method is as follows: 

• Mounting height A is useful in calculating the distance to the highest point 
• Stand-off A1 helps in measuring the distance from the reference surface to the lowest point of the package 
• Body thickness A2 is useful in obtaining the thickness of the package 
• Lead widths bp and b1, lead thickness c and c1 helps in calculating lead width and thickness 
• Measures the Soldered portion length 
• Coplanarity y helps in calculating the vertical distances from the surface plate to the lowest surfaces 
• Calculates the virtual plane 

By applying BS EN 60191-6-21 you can avoid defects or failures while transporting, storing, or handling these surface mounted semiconductor devices. This helps in preventing these devices from external factors by packing these devices.