What is BS EN 60191-6-4 - Package dimensions of ball grid array (BGA) about?
BS EN 60191-6-4 is the fourth part of a multi-series standard used for Mechanical standardization of semiconductor devices that specifies the measurement method for surface mounted semiconductor device packages. This helps in designing and manufacturing semiconductor device packages.
BS EN 60191-6-4 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Who is BS EN 60191-6-4 - Package dimensions of ball grid array (BGA) for?
BS EN 60191-6-4 on Mechanical standardization of semiconductor devices is useful for:
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Manufacturers of semiconductor devices
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Manufacturers of electronic devices
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Manufacturers of automotive parts
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Electronic engineers
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Semiconductor foundries
Why should you use BS EN 60191-6-4 - Package dimensions of ball grid array (BGA)?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-4 specifies the measuring method and procedure for package dimensions of the ball grid. The measuring methods are as follows:
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Datum S as pertaining to ball coplanarity is useful in determining the datum S by calculating LMS
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Calculates width and length and helps in determining the dimensions of these packages
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Profile of a package edge surface v determines the package size of the directions
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Mounting height, A is useful in measuring the distance to the highest point
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Measures the distance between First stand-off
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Second stand-off is the distance measured from the calculated datum S
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Ball diameter b is useful in measuring the diameter of a circle circumscribed about the ball.
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Ball centre position X determines the difference between the theoretically correct position of each ball’s centre and the actual position
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Ball coplanarity y is useful in measuring the distance from the lowest point of the top ball
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Package top flatness is useful in measuring the flatness of these package
BS EN 60191-6-4 can be your best guide in designing these semiconductor device packages. By applying BS EN 60191-6-4, you can standardize the manufacturing process that results in designing and producing good quality semiconductor device packages. This helps in avoiding the failures or defects while transporting, storing, and handling these devices.