BS EN 60191-6-1 is the sixth part of a multi-series standard used for Mechanical standardization of semiconductor devices that specifies the outline dimensions for gull-wing lead terminals. This helps in designing and producing good quality gull-wing lead terminals used in packing these surface mounted semiconductor device.
BS EN 60191-6-1 covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4 1). BS EN 60191-6-1 is intended to establish common rules on terminal shapes irrespective of package types.
BS EN 60191-6-1 on Mechanical standardization of semiconductor devices is useful for:
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-1 specifies the package height, thickness, and width of the terminal for designing these gull-wing lead terminals used for semiconductor devices. The outline dimensions are useful in designing and constructing these gull-wing lead terminals.
BS EN 60191-6-1 can be your best guide in designing these gull-wing lead terminals used in surface mounted semiconductor device packages. This helps in protecting these devices from the defect that arises while transporting, storing, and handling these surface mounted semiconductor devices. By applying BS EN 60191-6-1, you can design and manufacture good quality gull-wing lead terminals used in packing surface mounted semiconductor devices.
EN 60191-6-1:2001
IEC 60191-6-1:2001