BS EN 60191-6-8 is the sixth part of a multi-series standard used for the mechanical standardization of semiconductor devices. This helps in designing and manufacturing good quality surface mounted semiconductor device packages.
BS EN 60191-6-8 provides the common outline drawings and dimensions for all types of structures and is composed of materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain the interchangeability of G-QFP.
BS EN 60191-6-8 on outline drawings of surface mounted semiconductor device packages is useful for:
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material. Hence, packing these materials helps in avoiding the defects while transporting, storing, and handling these devices.
BS EN 60191-6-8 specifies the dimension for surface mounted semiconductor device packages. This helps in designing these packages for semiconductor devices. With the help of these dimensions, you can identify the materials to be used in constructing these packages.
BS EN 60191-6-8 can be your best guide in preparing outline drawings of surface mounted semiconductor device packages. By applying BS EN 60191-6-8, you can standardize the manufacturing process which helps in producing good quality surface mounted semiconductor device packages. This helps in avoiding the defects and failures of these devices from external factors.
EN 60191-6-8:2001
IEC 60191-6-8:2001