Standard

BS EN 60191-6-18:2010

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Current

•

Published:

30 Apr 2010

1 Scope

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Product Details

Descriptors

Dimensions

Standardization

Interchangeability

Designations

Drawings

Technical drawing

Integrated circuits

Surface mounting devices

Packages

Design

Engineering drawings

Semiconductor devices

Electronic equipment and components

ICS Codes

31.080.01 Semiconductor devices in general

Committee

EPL/47

International relationships

Identical to:

IEC 60191-6-18:2010/COR1:2010

ISBN

978 0 580 71947 9

Publisher

BSI