BS EN 60191-6-13 is a European Standard that discusses the mechanical standardization of semiconductor devices.
BS EN 60191-6-13 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.
BS EN 60191-6-13 on open-top-type sockets for FBGA and FLGA is relevant to:
Semiconductors are a vital component of electronic equipment, allowing for advancements in communications, computers, healthcare, military systems, transportation, clean energy, and a variety of other fields.
BS EN 60191-6-13 aims to standardize the outer dimensions of the sockets for FBGA and FLGA, where leading-edge developments are aggressively innovated, to establish their compatibility with the needs of the surface-mount industry that is globally expanding due to enhanced functions and performances of electrical devices.
For defining each dimension, the target was to indicate BS EN 60191-6-13 design value which has the concept of the design centre as much as possible, aiming to enhance the function as a standardization index.
BS EN 60191-6-13:2016 supersedes BS EN 60191-6-13:2007, which is withdrawn. BS EN 60191-6-13:2016 includes some technical changes with respect to BS EN 60191-6-13:2007. These include:
EN 60191-6-13:2016
IEC 60191-6-13:2016