BS EN 61249-4-15 is an international standard that discusses materials for printed boards and other interconnecting structures, enabling performance and longevity in printed board assemblies.
BS EN 61249-4-15 gives requirements for properties of prepreg that are intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.
BS EN 61249-4-15 mentions prepreg as defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved using brominated fire retardants contained as an integral part of the polymeric structure. After curing the prepreg according to the supplier’s instructions, the glass transition temperature is defined to be 150 °C and 200 °C.
BS EN 61249-4-15 on Sectional specification set for prepreg unclad materials is useful for:
PCB is essential in all electronic devices, whether they are used for residential or industrial applications. In a multi-processor context, the interconnection arrangement can determine total system performance.
BS EN 61249-4-15 provides you with information about the material and construction as well as describes properties such as dewetted areas, flammability, electric strength, water absorption, and their respective requirements, ensuring the safety and performance of printed boards.
If you are a manufacturer, especially of multilayer boards, you can improve your quality management systems by adopting best industry practices for conformance and qualification inspection and exhibiting compliance with BS EN 61249-4-15 requirements.
Compliance with requirements and tests provided by BS EN 61249-4-15 can thus demonstrate materials' reliability, quality, and performance for printed boards and interconnecting structures.EN 61249-4-15:2009
EN 61347-2-9:2001/A2:2006
IEC 61249-4-15:2009