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IEC 60191-2X:1999 | 30 Sep 1999 | BSI Knowledge
Standard
IEC 60191-2X:1999
IEC 60191-2-A22 Mechanical standardization of semiconductor devices - Dimensions - Plastic thin small outline package(P-TSOP II)7.62 body family
Current
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Published:
30 Sep 1999
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Product Details
Descriptors
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ICS Codes
31.080.01 Semiconductor devices in general
31.200 Integrated circuits. Microelectronics
Committee
EPL/47
International relationships
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ISBN
2-8318-4960-8
Publisher
IEC