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BS IEC 63055:2023 | 30 Nov 2023 | BSI Knowledge
Standard
BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Current
•
Published:
30 Nov 2023
Overview
Preview
References
History
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Product Details
Descriptors
Electromagnetic compatibility
Electronic equipment and components
Emission
Electric terminals
Printed-circuit boards
Electromagnetic fields
Integrated circuits
Noise (spurious signals)
Electrical conductance
Simulation
Mathematical models
ICS Codes
31.180 Printed circuits and boards
31.200 Integrated circuits. Microelectronics
35.060 Languages used in information technology
Committee
EPL/501
International relationships
Identical to:
IEC 63055 ED.2
ISBN
978 0 539 27840 8
Publisher
BSI