1 Scope

This part of IEC 60068‑2 establishes test methods for the resistance of electronic and electromechanical components, unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes, which are agreed between user and supplier for applications, where cleaning is required. These tests are not applicable to components, unpopulated circuit boards and assemblies, which are not intended to be subjected to cleaning processes.

Tests XD₁ and XD₂ primarily are intended for qualification testing of components and unpopulated circuit boards suitable for cleaning processes but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and unpopulated circuit boards.

Test XD₃ is intended to determine the resistance of electronic assemblies suitable for cleaning processes to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.