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Standard
Withdrawn

BS EN 60068-2-58:1999

Environmental testing. Test methods - Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Published:

15 Jul 1999

•

Withdrawn:

1 Jun 2005

Overview
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References
History
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Product Details
Descriptors
Electrical components
Environmental testing
Thermal testing
Visual inspection (testing)
Testing conditions
Electrical equipment
Heating tests
Thermal resistance
Electronic equipment and components
Chemical-resistance tests
Grades (quality)
Surfaces
Solderability testing
ICS Codes
19.040 Environmental testing
33.180.30 Optic amplifiers
Committee
GEL/104
International relationships
Identical to:

EN 60068-2-58:1999

IEC 60068-2-58:1999

IEC 61290-3-1:2003

ISBN
0 580 32527 X
Publisher
BSI