Publication

PD IEC/TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Current

•

Published:

7 May 2014

1 Scope

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

Product Details

Descriptors

Patterns

Electrical resistance

Dimensions

Holes

Electronic equipment and components

Voltage

Coated materials

Layout

Angles (geometry)

Printed-circuit boards

Fire safety

Protective coatings

Heat loss

Thickness

Position

Packaging materials

Electric conductors

Electrical insulation

Printed wiring

Finishes

Electric contacts

Packaging

Adhesive strength

Metal coatings

Printed circuits

Assembling

Flammability

Printed-circuit bases

Design

Electric current

Electrical connections

ICS Codes

31.180 Printed circuits and boards

Committee

EPL/501

International relationships

Identical to:

IEC TR 62866:2014

ISBN

978 0 580 83339 7

Publisher

BSI