PD IEC/TR 62343 is a series on Dynamic modules. Dynamic modules work by continuously assessing your performance and activity, then using data and analytics to provide personalized content in real-time to reinforce concepts that target particular strengths and weaknesses. PD IEC/TR 62343-6-5 is a technical report, that describes an investigation into operating mechanical shock and vibration for dynamic modules. PD IEC/TR 62343-6-5 also presents the results of a survey on the evaluation and mechanical simulation of mechanical shock and vibration testing. Also included is a study of standardization for operating mechanical shock and vibration test methods.
PD IEC/TR 62343-6-5 on dynamic modules is useful for:
The recent deployment of advanced, highly flexible optical communication networks using ROADM (reconfigurable optical add-drop multiplexing) systems has been accompanied by the practical utilization of dynamic wavelength dispersion compensators, wavelength blockers and wavelength selective switches as “dynamic modules.” Since these dynamic modules incorporate such new technology as MEMS (microelectromechanical systems), there are concerns about the vulnerability to operating shock and vibration conditions, which urgently require establishing evaluation methods and conditions. Standards for shock and vibration test conditions pertaining to storage and transport are already established, but methods and conditions for evaluating operating shock and vibration are not yet established.
The JIS (Japanese Industrial Standards) committee consequently conducted a questionnaire survey on the shock and vibration testing of passive optical components and dynamic modules in commercial use. The survey revealed that many respondents confirmed a need to standardize evaluation conditions for operating shock and vibration; some suggested earthquake, hammer impact testing and inserting an adjacent board as cases of shock and vibration during dynamic module operation. Based on the survey results, the JIS committee evaluated operating shock and vibration by conducting hammer impact tests using several dynamic modules, compared the results through simulation, and then recommended specific evaluation conditions. PD IEC/TR 62343-6-5 is based on OITDA (Optoelectronic Industry and Technology Development Association) – TP (Technical Paper), TP05/SP_DM-2008, "Investigation on operating vibration and mechanical impact test conditions for optical modules for telecom use." Using PD IEC/TR 62343-6-5 you can describe an investigation into operating mechanical shock and vibration for dynamic modules.
PD IEC/TR 62343-6-5:2014 supersedes PD IEC/TR 62343-6-5:2011. PD IEC/TR 62343-6-5:2014 includes a technical change with respect to PD IEC/TR 62343-6-5:2011. These include:
IEC TR 62343-6-5:2014