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25/30511572 DC | 11 Nov 2025 | BSI Knowledge
Standard
25/30511572 DC
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites
Current
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Published:
11 Nov 2025
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Product Details
Descriptors
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ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
EN 63609-2 Ed.1.0
IEC 63609-2 Ed.1.0
ISBN
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Publisher
BSI