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26/30511918 DC | 15 Apr 2026 | BSI Knowledge
Standard
26/30511918 DC
Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module
Current
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Published:
15 Apr 2026
Overview
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References
History
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Product Details
Descriptors
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ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
EN 62878-2-604 Ed.1.0
IEC 62878-2-604 Ed.1.0
ISBN
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Publisher
BSI