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IEC 62878-2-603:2025 | 25 Feb 2025 | BSI Knowledge
Standard
IEC 62878-2-603:2025
Device embedding assembly technology. - Part 2-603: Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Current
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Published:
25 Feb 2025
Overview
Preview
References
History
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Product Details
Descriptors
Assembly
Testing methods
Electrical testing
Electrical connections
Stacks
Bus networks
ICS Codes
31.180 Printed circuits and boards
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
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ISBN
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Publisher
IEC