BS EN IEC 62878-2-5:2019

What is BS EN IEC 62878‑2‑5 – Implementing the 3D data format for device embedded substrate about?

BS EN IEC 62878‑2‑5 is the fifth sub-part of the second part of an international standard used for device embedding assembly technology that is useful in transferring the information from printed board designers to the manufacturers and assemblers.  

BS EN IEC 62878‑2‑5 best practice guidelines can help you in implementing the3D data format for device embedded substrate. 

BS EN IEC 62878‑2‑5 specifies requirements based on an XML schema that represents a design

data format for device embedded substrate, which is a board comprising embedded active and

passive devices whose electrical connections are made by means of a via, electroplating,

conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g., stress, thermal, EMC), tooling, manufacturing,

assembly, and inspection requirements. Furthermore, the data format is used for transferring

information among printed board designers, printed board simulation engineer, manufacturers,

and assemblers.

Note 1: BS EN IEC 62878‑2‑5 applies to substrates using organic material.

Note 2: BS EN IEC 62878‑2‑5 neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as the M-type business model in IEC 62421.

Who is BS EN IEC 62878‑2‑5 - Implementing the 3D data format for device embedded substrate for?

BS EN IEC 62878‑2‑5 on device embedding assembly technology is useful for:

• Manufacturers of electronic devices
• Manufacturers of semiconductor devices
• Manufacturers of printed or circuit boards
• Manufacturers of substrate electronics

Why should you use BS EN IEC 62878‑2‑5 - Implementing the 3D data format for device embedded substrate?

Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate.

BS EN IEC 62878‑2‑5 guides you in understanding the 3D information of the electronic circuit boards, including device embedded substrate and SiP (system in package) which result in designing the flow of device embedded substrate.

The data description summary mentioned in BS EN IEC 62878‑2‑5 is useful in identifying the type and structure of data.

The data organization and data description mentioned in BS EN IEC 62878‑2‑5 could help you in constructing the board used in the device embedded substrate.

BS EN IEC 62878‑2‑5 specifies the data definition, 3D expression and substrate data that helps in designing the data format for device embedded substrate. 

Moreover, BS EN IEC 62878‑2‑5 navigates you through implementing the 3D data format for device embedded substrate which is useful in transferring the information from the printed board designers to the manufacturers and assemblers. 

What’s changed since the last update?

BS EN IEC 62878‑2‑5:2019 supersedes PD IEC/PAS 62878‑2‑5:2015. BS EN IEC 62878‑2‑5:2019 includes some technical changes with respect to PD IEC/PAS 62878‑2‑5:2015. These include

• The title has been changed to "Implementation of a 3D data format for device embedded substrate" from "Requirements of design date format for device embedded substrate"
• The scope of this implementation has changed to not include SiPs.