BS EN IEC 62878-2-602:2021

What is BS EN IEC 62878‑2‑602 about?  

BS EN IEC 62878‑2‑602 specifies the requirements and evaluation methods of electrical connectivity. BS EN IEC 62878‑2‑602 applies to stacked electronic modules. 

Who is BS EN IEC 62878‑2‑602  for? 

BS EN IEC 62878‑2‑602 on device embedding assembly technology is useful for: 

• Electrician and technicians 
• Workers who know the assembly  
• Engineers who are involved in quality assurance 

Why should you use BS EN IEC 62878‑2‑602?  

BS EN IEC 62878‑2‑602 is one of a series of guidelines for stacked electronic modules. High-end servers, network systems and smartphones have been driving electronic assembly technologies for the last couple of decades. Any applications to enable the “Internet of Things” (aka IoT) require new electronic assembly technologies to achieve small size, low energy consumption and robust security cost-effectively. 

BS EN IEC 62878‑2‑602 also tells about a 3D electronic module is an electronic module that is integrated and assembled using functional blocks, employing a three-dimensional or stacking method. A stacked electronic module is formed by mounting stackable device assembly technology modules vertically on top of one another.