PD IEC/TS 62878-2-3 is the second part of an international standard used for device embedded substrate. By using PD IEC/TS 62878-2-3 you can design and construct good quality device embedded structures that are used in circuit boards.
PD IEC/TS 62878-2-3 describes the design guide of device embedded substrates. The design guide of the device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products.
Note: PD IEC/TS 62878-2-3 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
Note: PD IEC/TS 62878-2-3 is not applicable to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
PD IEC/TS 62878-2-3 on Device embedded substrate is useful for:
Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate.
PD IEC/TS 62878-2-3 can be your best guide in designing this device embedded substrate. These design specification also includes :
PD IEC/TS 62878-2-3 specifies and recommends the conditions for base and embedding devices. This helps in understanding the structure of embedded devices that results in identifying the materials used in these devices.
By applying PD IEC/TS 62878-2-3, you can avoid failures and misinterpretations regarding these embedded devices. With the help of PD IEC/TS 62878-2-3, you can design, construct and assemble good quality device embedded substrates that are used in circuit boards.
IEC TS 62878-2-3:2015