BS EN IEC 62321-2:2021

What is BS EN IEC 62321‑2 about?  

BS EN IEC 62321‑2 series provides strategies of sampling along with the mechanical preparation of samples from electrotechnical products. These samples can be used for analytical testing to determine the levels of certain substances as described in the test methods in other parts of the BS EN IEC 62321 series. Restrictions for substances will vary between geographic regions and can be updated regularly. BS EN IEC 62321‑2 describes a generic process for obtaining and preparing samples before the determination of any substance of concern. 

BS EN IEC 62321‑2 has the status of a horizontal standard by BS EN IEC Guide 108 [2]. 

Note 1: BS EN IEC 62321‑2 does not provide sampling procedures for packaging and packaging materials. 

Note 2: BS EN IEC 62321‑2 does not provide guidelines for the assessment of compliance. 

Who is BS EN IEC 62321‑2 for? 

BS EN IEC 62321‑2 on disassembly of electrotechnical products and mechanical sample preparation is useful for: 

• Professional workers and technicians who know the assembly of the product 
• Electrician and technicians 
• Electrical engineers and quality assurance team  

Why should you use BS EN IEC 62321‑2?  

BS EN IEC 62321‑2 series describes how to complete disassembly separates all parts as far as possible, while still permitting reassembly to give an operational product. BS EN IEC 62321‑2 covers the detailed analysis of a complete electrotechnical product for certain substances that requires disassembled parts to be further separated by disjointment. 

BS EN IEC 62321‑2 also covers the complete disjointment process of all parts into their homogeneous materials. Generally, this is not practical because "complete disjointed" extends only as far as the available tools and techniques permit. 

BS EN IEC 62321‑2 informs that typical parts within complete electrotechnical products such as mobile phones, televisions, personal computers, refrigerators, are: 

• Printed circuit board assembly (PCBA) 
• Resistors 
• Capacitors 
• Semiconductor packages (ICs) 
• Transformers 
• Molded connectors 
• Heat sinks 
• Connecting cables, etc. 

What’s changed since the last update?  

BS EN IEC 62321‑2:2021 supersedes BS EN 62321‑2:2014. BS EN IEC 62321‑2:2021 includes some technical changes concerning BS EN 62321‑2:2014. These include: 

• Reference to the IEC 62321 series instead of to a list of individual parts of the IEC 62321 series  
• Update of the flow chart in Figure 1. Restructure of Clause 4 and update of examples in Annex A 
• Adjustment of the risk levels of certain parts and materials to reflect the recent technology development and material change. Update of Table B.1 to include the risk levels of phthalates. Creation of Table B.2 for other substances (e.g., HBCDD, PAH) in polymeric materials