NOTE 1 The test method dealing with internal stress type whisker, which is caused by the formation of intermetallic compound by diffusion, or by the formation of oxide film of the plating surface, or by the difference between coefficients of thermal expansion, is specified in IEC 60068‑2‑82.

NOTE 2 Physical changes during the application process may cause changes of the material qualities, so that this test cannot be used as a qualification test of a connector in ‘as produced’ condition.

NOTE 3 The conditions specified in this test may accelerate the growth of tin whiskers in a test specimen, but no correlation has been demonstrated between the extent of whisker growth, which may occur in this test, and the extent of whisker growth which may be expected in actual use. Whisker growth in actual use may therefore be less than or greater than the extent of whisker growth found when using this test.