BS EN IEC 61188‑6‑2 describes the requirements of design and use for soldering surfaces of land patterns on circuit boards. This document includes a land pattern for surface-mounted components.
BS EN IEC 61188‑6‑2 on circuit boards and circuit board assemblies are useful for:
The calculated land pattern geometry for an electronic component can be different depending upon the type of soldering process to be used. Wherever possible, land patterns should be defined in such a manner that is transparent to the attachment process being used.
BS EN IEC 61188‑6‑2 provides guidance on soldering methods for surface mounted components and requirements for soldering the components. BS EN IEC 61188‑6‑2 helps you designate circuit board components on the land pattern based on their terminal dimensions and the soldering method that would be suitable for them.
This enables the users of BS EN IEC 61188‑6‑2 to appropriately install the components on land pattern circuit boards.
EN 61188-6-2 Ed.1.0
IEC 61188-6-2 Ed.1.0