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20/30427157 DC | 8 Dec 2020 | BSI Knowledge
Standard
20/30427157 DC
BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808. Thermal resistance of dielectric layer by thermal transient method
Current
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Published:
8 Dec 2020
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Product Details
Descriptors
Structures
Open systems interconnection
Printing board
Testing methods
Electrical connections
Electrical conductivity
Electrically-conducting materials
Thermal resistance
Thermal behaviour of structures
ICS Codes
31.180 Printed circuits and boards
35.100.01 Open systems interconnection in general
Committee
EPL/501
International relationships
Identical to:
IEC 61189-2-808 Ed.1.0
ISBN
—
Publisher
BSI