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20/30409140 DC | 5 Feb 2021 | BSI Knowledge
Standard
Withdrawn
20/30409140 DC
BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA
Published:
5 Feb 2021
•
Withdrawn:
5 Nov 2021
Overview
Preview
References
History
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Product Details
Descriptors
Testing methods
Printing board
Open systems interconnection
Structures
ICS Codes
31.180 Printed circuits and boards
35.100.01 Open systems interconnection in general
Committee
EPL/501
International relationships
Identical to:
91/1647/CD
ISBN
—
Publisher
BSI