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23/30469010 DC | 3 Feb 2023 | BSI Knowledge
Standard
23/30469010 DC
BS EN IEC 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis
Current
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Published:
3 Feb 2023
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Product Details
Descriptors
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ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC 63378-3:2023
ISBN
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Publisher
BSI