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23/30469486 DC | 7 Feb 2023 | BSI Knowledge
Standard
23/30469486 DC
BS EN IEC 63378-2. Thermal standardization on semiconductor packages - Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
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Published:
7 Feb 2023
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Product Details
Descriptors
Standardization
Semiconductors
Packages
Thermal resistance
Accuracy
Mathematical models
Models (testing)
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
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ISBN
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Publisher
BSI