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25/30510059 DC | 7 Feb 2025 | BSI Knowledge
Standard
25/30510059 DC
BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
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Published:
7 Feb 2025
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Product Details
Descriptors
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ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
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ISBN
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Publisher
BSI