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19/30396945 DC | 29 Nov 2019 | BSI Knowledge
Standard
19/30396945 DC
BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
Current
•
Published:
29 Nov 2019
Overview
Preview
References
History
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Product Details
Descriptors
Test methods
Printed-circuit boards
Stress
Thermal stress
Reliability
Assessed reliability
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
IEC 63251 Ed.1.0
ISBN
—
Publisher
BSI