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20/30394767 DC | 11 Sep 2020 | BSI Knowledge
Standard
Withdrawn
20/30394767 DC
BS EN IEC 62878-2-601. Device Embedding assembly technology - Part 2-602. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Published:
11 Sep 2020
•
Withdrawn:
20 Aug 2021
Overview
Preview
References
History
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Product Details
Descriptors
Components
Modules
Evaluation
Electronic equipment and components
Assembly
ICS Codes
31.180 Printed circuits and boards
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
IEC 62878-2-601 Ed.1.0
ISBN
—
Publisher
BSI