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23/30454374 DC | 20 Apr 2023 | BSI Knowledge
Standard
23/30454374 DC
BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices - Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures
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Published:
20 Apr 2023
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Product Details
Descriptors
Semiconductor materials
Electronic devices
Silicon chips
Measurement
Bending strength
Electromechanical devices
ICS Codes
31.080.99 Other semiconductor devices
Committee
EPL/47
International relationships
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ISBN
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Publisher
BSI