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21/30441791 DC | 30 Jul 2021 | BSI Knowledge
Standard
21/30441791 DC
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809. X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
Current
•
Published:
30 Jul 2021
Overview
Preview
References
History
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Product Details
Descriptors
Materials by form
Printed-wiring boards
Printing board
Boards
Board (paper)
ICS Codes
29.035.10 Paper and board insulating materials
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
IEC 61189-2-809 ED1
ISBN
—
Publisher
BSI