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21/30446636 DC | 29 Oct 2021 | BSI Knowledge
Standard
21/30446636 DC
BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808. Thermal resistance of an assembly by thermal transient method
Current
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Published:
29 Oct 2021
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Product Details
Descriptors
Printing board
Structures
Testing methods
Open systems interconnection
Electrical connections
Electrical conductivity
Electrically-conducting materials
Thermal resistance
Thermal behaviour of structures
ICS Codes
31.180 Printed circuits and boards
35.100.01 Open systems interconnection in general
Committee
EPL/501
International relationships
Identical to:
IEC 61189-2-808 ED1
ISBN
—
Publisher
BSI