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18/30372182 DC | 19 Nov 2018 | BSI Knowledge
Standard
18/30372182 DC
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials
Current
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Published:
19 Nov 2018
Overview
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References
History
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Product Details
Descriptors
Performance
Thermal conductivity
Structures
Printing board
Test methods
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
IEC 61189-2-801 Ed.1.0
ISBN
—
Publisher
BSI