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24/30502907 DC | 13 Dec 2024 | BSI Knowledge
Standard
24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
Current
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Published:
13 Dec 2024
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Product Details
Descriptors
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ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
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ISBN
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Publisher
BSI