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24/30502824 DC | 13 Dec 2024 | BSI Knowledge
Standard
24/30502824 DC
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods
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Published:
13 Dec 2024
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Product Details
Descriptors
Semiconductor devices
Strength of materials
Mechanical tests
Integrated circuits
Environmental testing
Electronic equipment and components
Climate
ICS Codes
29.100.10 Magnetic components
31.080.01 Semiconductor devices in general
Committee
EPL/46
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ISBN
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Publisher
BSI