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22/30443234 DC | 24 Jan 2022 | BSI Knowledge
Standard
22/30443234 DC
BS EN 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
Current
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Published:
24 Jan 2022
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Product Details
Descriptors
Semiconductor manufacture
Semiconductor materials
Semiconductor technology
Protection (thermal)
Resistance (thermal)
Stability (thermal)
Thermal measuring
Thermal diffusion
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC 63378-3 ED1
ISBN
—
Publisher
BSI