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18/30375624 DC | 13 Jul 2018 | BSI Knowledge
Standard
18/30375624 DC
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods - Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Current
•
Published:
13 Jul 2018
Overview
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References
History
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Product Details
Descriptors
Climate
Materials handling
Damp-heat tests
Environment (working)
Environmental testing
Packaging
Mechanical testing
Surface mounting devices
Electronic equipment and components
Integrated circuits
Soldering
Labelling (process)
Thermal testing
Transportation
Semiconductor devices
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC 60749-20-1 Ed.2.0
ISBN
—
Publisher
BSI