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Standard
Withdrawn

BS EN 60249-1:1993

Base materials for printed circuits - Base materials for printed circuits. Test methods

Published:

29 Jul 1983

•

Withdrawn:

1 Oct 2006

Overview
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References
History
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Product Details
Descriptors
Films (states of matter)
Density measurement
Visual inspection (testing)
Blistering
Adhesion tests
Coated materials
Test equipment
Metal coatings
Dimensional measurement
Dimensional changes
Specimen preparation
Electronic equipment and components
Corrosion tests
Surface defects
Flammability
Bend testing
Flatness measurement
Test specimens
Damp-heat tests
Laminates
Fatigue testing
Resistance measurement
Fire tests
Printed-circuit bases
Electrical testing
Sample location
Peeling tests
Weight measurement
Foil
Sheet materials
Dimensions
Copper
Dielectric-strength tests
Mechanical testing
Thickness measurement
Printed circuits
Printed-circuit boards
Humidity
Permittivity measurement
Thermal testing
Dissipation factor
Thermal-shock tests
Strength of materials
Tracking tests
High-temperature testing
Environmental testing
Solderability testing
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:

IEC 60249-1:1982

ISBN
0 580 13343 5
Publisher
BSI