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BS EN 60249-2-13:1994 | 28 Feb 1990 | BSI Knowledge
Standard
Withdrawn
BS EN 60249-2-13:1994
Base material for printed circuits. Specifications - Flexible copper-clad polyimide film, general purpose grade
Published:
28 Feb 1990
•
Withdrawn:
1 Oct 2006
Overview
Preview
References
History
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Product Details
Descriptors
Fatigue
Copper
Printed-circuit boards
Surface defects
Dissipation factor
Thickness
Dielectric strength
Rolls
Dimensional changes
Marking
Electrical resistance
Metal coatings
Grades (quality)
Dimensional tolerances
Films (states of matter)
Polymers
Wettability
Printed circuits
Printed-circuit bases
Bending
Coated materials
Polyimides
Permittivity
Flexible materials
Adhesive strength
Electrical resistivity
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
IEC 60249-2-13:1987
ISBN
0 580 18186 3
Publisher
BSI