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BS EN 61190-1-2:2007 | 31 Jul 2007 | BSI Knowledge
Standard
Withdrawn
BS EN 61190-1-2:2007
Attachment materials for electronic assembly - Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published:
31 Jul 2007
•
Withdrawn:
30 Jun 2014
Overview
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References
History
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Product Details
Descriptors
Quality control
Bonding
Quality assurance
Solders
Electronic equipment and components
Electrical connections
Pastes
Soldering
Electronic engineering
Classification systems
Soldered connectors
ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
EN 60191-4:1999/A1:2002
EN 61190-1-2:2007
IEC 61190-1-2:2007
ISBN
978 0 580 55336 3
Publisher
BSI