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BS EN 61190-1-2:2002 | 12 Aug 2002 | BSI Knowledge
Standard
Withdrawn
BS EN 61190-1-2:2002
Attachment materials for electronic assembly - Requirements for solder pastes for high-quality interconnections in electronic assembly
Published:
12 Aug 2002
•
Withdrawn:
31 Jul 2007
Overview
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References
History
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Product Details
Descriptors
Electronic equipment and components
Soldering
Soldered connectors
Solders
Electronic engineering
Quality assurance
Bonding
Quality control
Electrical connections
Pastes
Classification systems
ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
EN 61190-1-2:2002
IEC 61190-1-2:2002
ISBN
0 580 40233 9
Publisher
BSI